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LED PCB board sensor UL Certificate aluminum pcb
  • LED PCB board sensor UL Certificate aluminum pcb
  • LED PCB board sensor UL Certificate aluminum pcb
  • LED PCB board sensor UL Certificate aluminum pcb
Unit Price: 0.22 USD
Min. Order: 1 Piece/Pieces
Packaging: Vacuum packing
Basic Info

Model No.: Aluminium nitride ceramic PCB

Product Description

How to make ceramic PCB?

With the rapid development of power electronic circuits in the direction of integration and modularization, various new types of power Electronic Components continue to emerge, and the demand for power electronic devices continues to increase, resulting in an increasing demand for high-performance PCBs. At the same time, with the development of electronic, communication and other equipment in the direction of miniaturization, light weight, high reliability and high speed, especially to meet the needs of Surface-Mount (SMT) & BGA Assembly, the preparation of high-performance PCBs tends to be miniaturized and chip-type The development of high-quality, multi-layer, thin-film, and high-reliability directions requires PCBs with high stability, high thermal conductivity, high temperature resistance and low high-frequency loss.
Ceramics are widely used in high-power power semiconductor modules, semiconductor refrigerators, and electronics due to their high insulation, high chemical stability, high thermal conductivity, and thermal expansion coefficient matching a variety of semiconductor device materials. In heaters and high-power power electronic circuits.

Aluminium Nitride Ceramic Pcb Jpg
Because the surface structure of ceramic materials is different from the surface structure of metal materials, coupled with the special physical and chemical properties of the ceramic material itself, there are many characteristics and difficulties in preparing metal circuit patterns with high resolution, current density and overload power on the ceramic surface.
Aluminum Nitride Pcb Jpg
At present, there are thick film method, thin film method and dbc for metallization of ceramic surface.
The thick film method is mainly a high melting point metal method, including mo-mn method, silver-based brazing, screen printing, active metal powder sintering. It is made by coating paste on the ceramic surface and sintering in a heat treatment furnace. Part of the process needs to be carried out. Hydrogen reduction secondary treatment. This type of process has no restrictions on ceramic materials. The metal coating and ceramic have high bonding strength, but the disadvantages are very obvious. The processing temperature is above 900°C, high energy consumption, long production cycle, and low efficiency. It cannot be used to make multilayer and thin-film high-performance ceramic PCBs. It is mainly used as a seal between ceramics and metals, and has limited applications in the field of ceramic PCBs.
Thin film methods are mainly cvd/pvd, electroplating/electroless plating, and sputtering methods. This type of process can coat different types of ceramic surfaces with metal coatings, but the coating is thin, with many procedures, low efficiency, and high cost. This type of process As a supplementary process for patterning the metal layer on the ceramic surface, it has limited application in the field of ceramic pcb.
ceramics base copper-clad laminates is the abbreviation for direct bonded copper, which is a process of placing copper foil directly on alumina or aluminum nitride ceramics in a protective atmosphere, and keeping the temperature at 1065°C for 40-60 minutes. The eutectic reaction between the ceramics forms a transition layer, which is directly bonded to the ceramic surface. This process has fewer steps, can be used as a metal pattern or as a connecting metal, has high bonding strength, large current carrying, and strong solderability. It is the mainstream process for ceramic PCBs. Although this process has many advantages, it can only generate eutectic phases of complex oxides such as cu(alo2)2 and cu(alo2) on the surface of specific types of ceramics (aluminum nitride, alumina), thereby completing direct bonding on the ceramic surface. Combined with copper foil, the process is complicated and the cost is high.
Aluminum Oxide Pcb Jpg
In summary, the ceramic substrate printed board, as a key process for preparing high-performance ceramic PCBs, has a difficulty in the metallization of the ceramic surface: either the processing temperature is too high, or the types of ceramic materials are limited. Therefore, there is a need for a high-performance ceramic pcb process with high resolution, current density, and overload power that has low processing temperature, high bonding strength, and no restrictions on the types of ceramic materials, to replace the current ceramic surface metallization medium-thick film method, The disadvantages of the thin film method and the dbc process.

HAODA ELECTRONIC CO.,LIMITED

  HAODA ELECTRONIC CO.,LIMITED specializes in high-speed turn-key PCB services:PCB design, PCB Fabrication, PCBA and Components Sourcing, we provide services for about 4000 customers around the world. HAODA ELECTRONIC CO.,LIMITED is a local factory focused on the "multiple species, short delivery time, rapid prototype" PCB manufacturers in Shenzhen . Company Had accumulated plenty of advantages over the years in PCB prototype, PCB mass production , with the help of many years of experience in the PCB industry and technology precipitation, the company reputation continues to improve, product quality has been recognized by different type customers all over the world...

We can serve you:

  • 0-18Layer FR4 board:

1 layer LED Based Night Lamp
4 Layer Power line Circuits
6 Layer Laser Circuits
8 Layer Button Motor Controller Circuits
12 Layer Touch Activated Switch Circuits

  • Quick Turn PCB:

12 hours for 2 layer PCB
24 hours for 4 layer PCB
48 hours for 6layer PCB


  • High Frequency Board

Roger 4003 printed board
Roger 4350 printed board
ceramics base copper-clad laminates
mulit-wiring printed board
industrial control PCB

HDI PCB
BVH(buried/blind via hole)PCB
Ro4350B+FR4 hybrid Board
Flame resistant PCB
Metal Core PCB (MCPCB)
  • Rigid-Flex Board

6 layer Rigid-flex Immersion Gold PCB
BVH(buried/blind via hole)PCB
Characteristic impedance CPB
Flame resistant PCB
Metal Core PCB (MCPCB)

  • Aluminum Base Board

Aluminum 2.0W LED board
Aluminum 3.0W LED board
communication PCB
Aluminum base board
Aluminum LED board

  • PCB Assembly Products

Through-Hole Assembly
Turkey PCB Assembly
PCBA Manufacturing
Surface-Mount (SMT) &BGA Assembly
Box Build Assembly
Mixed Assembly

  • PCBA Components Sourcing

Parting Sourcing
Electronic Components
Electronic connectors
Cable Connectors I/O Connectors
originality electronics IC
Electronic Resistor and Capacitor




Company Info
  • Company Name: HAODA ELECTRONIC CO.,LIMITED
  • Representative: Gansu QingYang
  • Product/Service: PCB , PCBA , PCB assembly , Quick Turn PCB , High frequency board , Rigid-Flex Board
  • Capital (Million US $): 1000,000RMB
  • Year Established: 2015
  • Total Annual Sales Volume (Million US $): US$50 Million - US$100 Million
  • Export Percentage: 91% - 100%
  • Total Annual Purchase Volume (Million US $): Below US$1 Million
  • No. of Production Lines: 21
  • No. of R&D Staff: 11 -20 People
  • No. of QC Staff: 51 -60 People
  • OEM Services Provided: yes
  • Factory Size (Sq.meters): 50,000-100,000 square meters
  • Factory Location: Building 2, Gangbei Industrial Zone, Huangtian, Hangcheng Street, Baoan District, Shenzhen
  • Contact Person: Mr. Gan QingYang
  • Tel: +86-0755-23720053
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