Product Description
Model NO.: RY-T069 Type: Insulation Film Material: Ceramic Maximum Voltage: 20KV~100KV Certification: UL, ISO9001, SGS Brand: Ry Origin: China Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate Chemistry: Plate Substrate Thermal Rating: 250 250 Classification: Hybrid Insulation Materials Color: White Specification: customized HS Code: 854710000 Ceramic substrate
1. Alumina ( Al2O3 substrate )
Al2O3 substrate is the most popular ceramic substrate, with excellent heat
resistance, high mechanical strength , abrasion resistance and small dielectric
loss.The surface of alumina substrate is quite smooth and low porosity.99.6%
alumina substrate is suitable for thin film device, 96% alumina substrate is suitable for thick film device application .
2. Aluminium Nitride ( AlN substrate )
Aluminium Nitride has higher thermal conductivity, compared to alumina substrate. It is about 7 to 8 times high. AlN substrate is an excellent electronic package material.
3. Zirconia ( ZrO2 substrate )
Compared to alumina substrate, ZrO2 substrate has higher mechanical strength and fracture toughness it's about three times higher for bending strength, two times for fracture toughness than alumina substrate. ZrO2( zirconia ) also provides good abrasion resistance. It features a thermal expansion rate close to metals.
| Ceramic Substrates Properties |
| Materials | Al2O3 | AlN | ZrO2 |
| 96% | 99.60% |
| Color | White | White | Gray | White |
| Density (g/cm 3 ) | 3.72 | 3.85 | 3.3 | 6.04 |
| Thermal conductivity (W/m. K) | 22.3 | 29.5 | 160 -190 | 2.4 |
| Thermal Expansion (x10 -6 / o C) | 8 | 8.2 | 4.6 | 10 |
| Dielectric strength | 1.40E+07 | 1.80E+07 | 1.40E+07 | |
| Dielectric Constant (at 1MHZ) | 9.5 | 9.8 | 8.7 | 29 |
| Loss Tangent (x10 -4 at 1MHZ) | 3 | 2 | 5 | 1.00E-03 |
| Volume Resistivity (ohm-m) | >10 14 | >10 14 | >10 14 | |
| Flexural Strength (N/mm 2 ) | 350 | 500 | 450 | |
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